Advances in Condition Monitoring and Structural Health Monitoring, Volume 4
Select Proceedings of WCCM 2024
Bin Hu editor Len Gelman editor Gongtian Shen editor Junjiao Zhang editor
Format:Paperback
Publisher:Springer Verlag, Singapore
Published:21st Feb '26
Should be back in stock very soon

This book presents select proceedings of the 3rd World Congress on Condition Monitoring (WCCM 2024). It examines condition monitoring methods, including vibration, acoustics, optics, electromagnetism, infrared thermal imaging, guided waves, stress, etc. The topics covered include signal detection and processing, condition monitoring instrumentation and methods, diagnosis, assessment and prediction, and advanced condition monitoring technology. The book also discusses the various applications of condition monitoring in components and equipment across different industries. This book is a valuable reference for researchers and professionals interested in condition monitoring and allied fields.
ISBN: 9789819548811
Dimensions: unknown
Weight: unknown
462 pages